A 160Gb/s (4x40) WDM O-band Tx subassembly using a 4-ch array of silicon rings co-packaged with a SiGe BiCMOS IC driver

We present a 400 (8×50) Gb/s-capable RM-based Si-photonic WDM O-band TxRx with 1.17nm channel spacing for high-speed optical interconnects and demonstrate successful 50Gb/s-NRZ TxRx operation achieving a ~4.5dB Tx extinction ratio under 2.15Vpp drive

Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges

End-to-end optical packet switching with burst-mode reception at 25 Gb/s through a 1024-port 25.6 Tb/s capacity Hipoλaos Optical Packet Switch

We demonstrate end-to-end 25Gb/s true optical packet switching featuring burst-mode reception with <;50ns locking time through a 1024-port 25.6Tb/s capacity Hipoλaos Optical Packet Switch architecture. Error-free performance at 10 -9 was obtained for all validated port-combinations

Optically-Enabled Bloom Filter Label Forwarding Using a Silicon Photonic Switching Matrix

Simplified forwarding schemes relying on Bloom filter (BF)-based labels emerge as a promising approach for coping with the substantial increase in lookup table memory requirements associated with the growing number of end-hosts in DataCenters. In this paper, we present for the first time the successful implementation of a BF-label forwarding scheme over a silicon photonic switch fabric and we demonstrate its functionality with 10 Gb/s data packets that carry BF-encoded labels. The optically enabled BF-label forwarding setup utilizes a Si-based 4 × 4 electro-optic switch directly controlled by an amplifier-less and digital-to-analog-converter-less high speed Field Programmable Gate Array board. The FPGA is responsible for extracting the BF-label from the incoming packets and for carrying out the BF-based forwarding function, determining the appropriate switching state towards conveying incoming packets to the desired output. The use of BF-label forwarding allows for rapid switch reconfiguration avoiding the need for large look-up table updates as the network topology changes and devices are added, removed or simply change physical location. Successful operation for 10 Gb/s data packets has been obtained for a 1 × 4 routing layout. © 1983-2012 IEEE